KOTRA ADITYA
2 महीने 6 दिन पहले
Honourable PM sir, Laptop assembly isn’t just about putting together PCBs, batteries, and displays. A critical bottleneck is semiconductor packaging and testing: Chips for CPUs, GPUs, Wi-Fi modules, and power controllers must be packaged and tested before they can be mounted on motherboards. Without local OSAT, India’s assemblers depend on imported packaged chips, adding cost and delays. Taiwanese OSAT (ASE, Powertech, SPIL)-Impact on laptops: They can set up joint OSAT hubs in India’s electronics clusters (Tamil Nadu, Noida, Gujarat) to package chips used in laptops locally. US OSAT (Amkor Technology)-Impact on laptops: Amkor can partner with Tata Electronics or Bharat Electronics Limited (BEL) to ensure secure chip testing for laptops used in government, defense, and education. Extend PLI 2.0 to cover OSAT investments for laptop-related chips. Cluster Integration: Co-locate OSAT hubs with laptop assembly plants (Foxconn in Tamil Nadu, Dixon in Noida).
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